Japan MHLW Notice No. 370 sets standards for foods, additives, apparatus, and containers and packaging. Section III contains food-contact apparatus and packaging provisions, including lead and antimony composition limits for tin plating, metals used for food-contact parts, and solder. The loaded rows cover only the product-composition limits stated as percent by weight. Migration and positive-list provisions in the same notice are not converted into species-specific product-content rows.
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